GB/T 44842-2024: Micro-electromechanical systems(MEMS) technology - Bend testing methods of thin film materials

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Scope

This document describes a bending test method for thin-film materials with a length
and width of less than 1 mm and a thickness ranging from 0.1 µm~10 µm. Thin films
serve as primary structural materials in micro-electromechanical systems (MEMS) and
micromechanics.
As primary structural materials in devices such as micro-electromechanical systems
(MEMS) and micromechanical components, thin films possess unique characteristics -
specifically, dimensions on the order of a few micrometers, fabrication via processes
such as deposition and photolithography, and/or the utilization of non-machined test
structures. This document describes the bending test method and the geometry of
smooth, cantilever-type test structures at the micro-scale, designed to ensure testing
accuracy commensurate with the unique characteristics of thin-film materials.

Basic Data

Standard ID	GB/T 44842-2024 (GB/T44842-2024)
Description (Translated English)	Micro-electromechanical systems(MEMS) technology - Bend testing methods of thin film materials
Sector / Industry	National Standard (Recommended)
Classification of Chinese Standard	L59
Classification of International Standard	31.080.99
Word Count Estimation	16,193
Date of Issue	2024-10-26
Date of Implementation	2024-10-26
Issuing agency(ies)	State Administration for Market Regulation, China National Standardization Administration