GB/T 35010.6-2018: Semiconductor die products -- Part 6: Requirements for concerning thermal simulation

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Scope

This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. Semiconductor chip products include.
● Wafer;
● a single bare chip;
● chips and wafers with interconnect structures;
● Minimal or partially packaged chips and wafers.
This section specifies the required thermal simulation information to facilitate the use of electronic system thermal behavior and functional verification simulation models. electronic
The system includes a semiconductor bare chip with or without an interconnect structure, and/or a minimally packaged semiconductor chip. This part is to make the chip
All aspects of the supply chain meet the requirements of IEC 62258-1 and IEC 62258-2.

Basic Data

Standard ID	GB/T 35010.6-2018 (GB/T35010.6-2018)
Description (Translated English)	Semiconductor die products -- Part 6: Requirements for concerning thermal simulation
Sector / Industry	National Standard (Recommended)
Classification of Chinese Standard	L55
Classification of International Standard	31.200
Word Count Estimation	6,635
Date of Issue	2018-03-15
Date of Implementation	2018-08-01
Issuing agency(ies)	State Administration for Market Regulation, China National Standardization Administration