GB/T 17473.7-2008: Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance

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Scope

This standard specifies the method for determining the solderability and
solderleaching resistance of precious metal solder pastes, which are used in
microelectronics technology.
This standard is applicable to the determination of solderability and
solderleaching resistance of precious metal solderable pastes, which are used
in microelectronics technology.

Basic Data

Standard ID	GB/T 17473.7-2008 (GB/T17473.7-2008)
Description (Translated English)	Test methods of precious metals pastes used for microelectronics -- Determination of solderability and solderelaching resistance
Sector / Industry	National Standard (Recommended)
Classification of Chinese Standard	H68
Classification of International Standard	77.120.99
Word Count Estimation	5,525
Date of Issue	2008-03-31
Date of Implementation	2008-09-01
Older Standard (superseded by this standard)	GB/T 17473.7-1998
Regulation (derived from)	National Standard Approval Announcement 2008 No.5 (Total No.118)
Issuing agency(ies)	General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary	This standard specifies the microelectronics precious metal solder paste can weldability, soldering resistance measurement method. This standard applies to microelectronics precious metal solder paste can weldability, resistance welding determination.