GB/T 2423.32-2008: Environmental testing for electric and electronic products - Part 2: Test Methods - Test Ta: Solderability test by the wetting balance method

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Scope

This Part of GB/T 2423 outlines Test Ta, solder bath wetting balance method applicable
for any shape of component terminations to determine the solderability. It is especially
suitable for reference testing and for components that cannot be quantitatively tested
by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be
applied if it is suitable.

Basic Data

Standard ID	GB/T 2423.32-2008 (GB/T2423.32-2008)
Description (Translated English)	Environmental testing for electric and electronic products - Part 2: Test Methods - Test Ta: Solderability test by the wetting balance method
Sector / Industry	National Standard (Recommended)
Classification of Chinese Standard	K04
Classification of International Standard	19.040
Word Count Estimation	15,147
Date of Issue	2008-03-24
Date of Implementation	2008-10-01
Older Standard (superseded by this standard)	GB/T 2423.32-1985; GB/T 2424.21-1985
Quoted Standard	GB/T 2421-1999; GB/T 2423.28-2005; IEC 61190-1-3-2002
Adopted Standard	IEC 60068-2-54-2006, IDT
Regulation (derived from)	Announcement of Newly Approved National Standards No. 5, 2008 (No. 118 overall)
Issuing agency(ies)	General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary	This standard applies to determine the components of any shape soldering terminals weldability, especially for arbitration tests and other methods can not be used for quantitative testing components soldered terminations weldability assessment. For surface mount devices should be used if appropriate IEC 60068-2-69.