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GB/T 2423.30-2013 English PDF (GBT2423.30-2013)

GB/T 2423.30-2013 English PDF (GBT2423.30-2013)

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GB/T 2423.30-2013: Environmental testing - Part 2: Test methods - Test XA and guidance: Immersion in cleaning solvents
GB/T 2423.30-2013
GB
NATIONAL STANDARD OF THE
PEOPLE’S REPUBLIC OF CHINA
ICS 19.040
K 04
Replacing GB/T 2424.30-1999
Environmental testing - Part 2: Test methods - Text XA
and guidance: Immersion in cleaning solvents
(IEC 60068-2-45:1980/Amd 1:1993, Basic environmental testing
procedures - Part 2: Tests - Text XA and guidance: Immersion in
cleaning solvents, MOD)
ISSUED ON: DECEMBER 17, 2013
IMPLEMENTED ON: JUNE 14, 2014
Issued by: General Administration of Quality Supervision, Inspection and
Quarantine of PRC;
Standardization Administration of PRC.
Table of Contents
Foreword ... 3 
1 Scope ... 5 
2 Purpose ... 5 
3 Types of test solvents and test conditions ... 5 
4 Initial inspection ... 6 
5 Condition test ... 6 
6 Recovery ... 7 
7 Final inspection ... 7 
8 Information to be provided by relevant specifications ... 7 
Appendix A (Informative) Guidelines for test XA ... 9 
Appendix NA (Informative) Composition of GB/T 2423 ... 13 
Environmental testing - Part 2: Test methods - Text XA
and guidance: Immersion in cleaning solvents
1 Scope
This part of GB/T 2423 is applicable to the test, in which the test sample is
immersed in a cleaning solvent, at a specified temperature, within a specified
time.
If required by the relevant specifications, the test sample shall be wiped by
absorbent cotton or tissue paper, after immersion and drying.
See Appendix A for the guidelines for this test.
2 Purpose
Determine the degree to which the electronic components (including
components, etc., the same below) or other parts, which are installed on the
printed circuit board, are affected by the cleaning agent, when they are
immersed in the cleaning agent as specified below.
Note: This test does not simulate the impact of other operations.
3 Types of test solvents and test conditions
3.1 Solvent
3.1.1 This test specifies the use of two common cleaning solvents.
Note: A good test result, which is obtained, according to this test method, does not
mean that it can withstand other solvents.
3.1.2 Isopropanol for industrial use. This solvent shall be used whenever
possible.
Note: This solvent has been sold as a finished chemical product.
3.1.3 Soft water or distilled water, which has a resistivity not less than 500 Ω·m
(equivalent to conductivity of 2 mS/m).
Note: In the case of technical appraisal, when relevant specifications have provisions,
it may use other solvents, which have similar activity to the specified solvent.
Note: It may use commercially available absorbent cotton, such as medical absorbent
cotton.
In this Part, "thin roll paper" refers to thin, soft, relatively tough paper, which is usually
used for packaging fragile items. Its unit mass is 12 g/m2 ~ 25 g/m2. It may also use
soft tissues on the market.
5.3 Method 2 (without wiping)
The test sample shall be completely immersed in a solvent, which is specified
in 3.1, at a certain temperature as specified in 3.2.1, for a duration as specified
in 3.2.2.
6 Recovery
After the test sample is taken out of the solvent, if the final electrical
performance and (or) mechanical performance test is required, the test sample
shall be placed, under standard test atmospheric conditions, for 1 h ~ 2 h,
before testing, OR after the time specified by the relevant specifications.
7 Final inspection
If the purpose of the test is to determine the impact on the surface of the marking,
encapsulation, coating, etc., the test sample shall be visually inspected.
If the purpose of the test is to determine the impact on the working performance
of the test sample, the relevant specifications may also require electrical and
(or) mechanical performance testing.
8 Information to be provided by relevant
specifications
When the test is included in the relevant specifications, the following information
shall be provided as much as possible:
Appendix A
(Informative)
Guidelines for test XA
A.1 Overview
Many components or parts, which are installed on printed circuit boards, are
subject to solvent cleaning processes.
In order to simulate the impact of this cleaning operation AND verify the solvent
resistance of components or parts, it shall use the test XA.
Test XA includes two aspects:
a) Determine the impact on the surface of the marking, packaging, coating,
etc.;
b) Determine the impact on the performance of the test sample.
After marking, after at least 48 h, to let the ink is in full contact air AND is dried,
before the test samples can be tested.
A.2 Cleaning
A.2.1 Basic considerations (test methods and solvents)
The printed circuit board (that is, the printed circuit board plus the components),
on which the components are soldered, can be cleaned in different ways.
In many cases, it is necessary to completely immerse the printed circuit board
in the prescribed solvent. In this case, the components on the board shall be
subjected to short-term immersion, in the relevant cleaning agent.
Usually, the cleaning agent used depends on the flux selected.
A.2.1.1 Printed circuit boards which use rosin-based flux
These circuit boards can be effectively cleaned, by the use of a mixture of
fluorocarbon and alcohol.
In order to remove flux and flux residues, printed circuit boards are usually
immersed in cold (room temperature) solvent, OR immersed in boiling solvent,
OR successively immersed in cold and boiling solvent.
A.2.1.2 Printed circuit boards which use water-soluble flux
and skin diseases, like touching other organic solvents.
Generally speaking, the actual cleaning process is to immerse the printed circuit board
in a solvent for 0.5 min ~ 2 min. In order to strengthen the treatment, the immersion
time is 5 min.
It needs to measure the temperature of the solvent, during the process of immersion
of components and parts in the solvent. The temperature must be kept within a given
range.
A.2.3 Wipe
In fact, after the printed circuit board is immersed in the cleaning agent, it shall
be wiped or brushed on the side where it is soldered, to remove insoluble
residues or certain impurity contaminants.
For this reason, if required by the relevant specifications, dry surfaces shall be
wiped, because wiping the wet surfaces may cause irreproducible effects. For
the usual printed circuit boards, wiping after the cleaning procedure is only to
judge whether the markings are legible.
In order to obtain good reproducibility and an operator-independent wiping
method, it shall use a suitable wiping device. A recommended device is an
analog "fingertip". It consists of a rubber disc, which has a diameter of 11.3 mm
(approximately 1 cm2), a thickness of 5 mm, a Shore hardness of 30 ~ 40,
whose back is installed on a hard (metal or plastic) disk or rod. This rubber disc
is covered with absorbent cotton or soft-thin paper gasket. When the gasket is
pressed, under the specified pressure, its thickness is about 1 mm. This
component is fixed to the pressure spring balance measuring instrument; the
suitable pressure is 10 N (about 1 kg).
For small components, it may use a scaled-down modified wiping device; the
top diameter is reduced to 5 mm (approximately 0.2 cm2); the force is about 1
N.
For good reproducibility, absorbent cotton and thin roll paper shall be selected
(see 5.2) with the best specifications. If deemed necessary and allowed by the
size of the test sample, the recommended wip...
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